US Patent Issued to International Business Machines on Aug. 25 for "Via alignment in single damascene structure" (New York Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,124, issued on Aug. 25, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Via alignment in single damascene structure" was invented by Chanro Park (Clifton Park, N.Y.), Koichi Motoyama (Clifton Park, N.Y.) and Hsueh-Chung Chen (Cohoes, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnect structure that in one embodiment can include a first metal line level having a first metal line, a second metal line level having a second metal line, and a via line level present between the first and second metal line levels. The via line level includes a via interlevel dielectric surrounding a via stack. The via stack may inclu...