US Patent Issued to INTERNATIONAL BUSINESS MACHINES on Aug. 18 for "Bonded structure having diffused metal oxide material surrounding misaligned bond pads or bond pads of different sizes and method of manufacturing thereof" (New York Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,961, issued on Aug. 18, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.).

"Bonded structure having diffused metal oxide material surrounding misaligned bond pads or bond pads of different sizes and method of manufacturing thereof" was invented by Mukta Ghate Farooq (Hopewell Junction, N.Y.) and James J. Kelly (Schenectady, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of present invention provide a semiconductor structure. The semiconductor structure includes a first copper pad embedded in a first dielectric layer; a second copper pad embedded in a second dielectric layer; and an oxygen-containing inter-layer, w...