ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,999, issued on April 7, was assigned to International Business Machines Corp. (Armonk, N.Y.).
"Multi-chip die alignment" was invented by Effendi Leobandung (Stormville, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of the present invention provide a semiconductor structure. The semiconductor structure may include a substrate having a first substrate alignment structure. The semiconductor structure may also include a first die with a first die alignment structure. The first die may be attached to the substrate with the first substrate alignment structure matched to the first die alignment structure."
The patent was filed on May 23, 202...