US Patent Issued to Intel on Sept. 9 for "Interleaved heterogeneous heat pipes with different Q max" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,414,269, issued on Sept. 9, was assigned to Intel Corp. (Santa Clara, Calif.).

"Interleaved heterogeneous heat pipes with different Q max" was invented by Gaurav Patankar (Chandler, Ariz.), Ruander Cardenas (Portland, Ore.), Mark MacDonald (Beaverton, Ore.) and Akhilesh P. Rallabandi (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Heterogeneous heat pipe solutions provide both low thermal resistance and a high Qmax. Some heterogeneous heat pipe solutions comprise multiple homogenous heat pipes operating in parallel, with each homogeneous heat pipe having its thermal performance tailored to handle a processor operating in a particular pow...