US Patent Issued to Intel on Sept. 29 for "Nano-roughened interconnects for integrated circuit packages" (Arizona Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,312, issued on Sept. 29, was assigned to Intel Corp. (Santa Clara, Calif.).

"Nano-roughened interconnects for integrated circuit packages" was invented by Suddhasattwa Nad (Chandler, Ariz.), Gang Duan (Chandler, Ariz.), Jeremy Ecton (Gilbert, Ariz.), Brandon Marin (Gilbert, Ariz.) and Ravindranath Mahajan (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, apparatus, and articles of manufacture to produce nano-roughened integrated circuit packages are disclosed. An example integrated circuit (IC) package includes a substrate, a semiconductor die, and a metal interconnect to electrically couple the semiconductor die to ...