US Patent Issued to Intel on Sept. 22 for "Hybrid bonding with photonic integrated circuits for high bandwidth reticle stitching of reticle sized integrated circuit dies" (Oregon, California, Arizona Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,742,927, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.).

"Hybrid bonding with photonic integrated circuits for high bandwidth reticle stitching of reticle sized integrated circuit dies" was invented by Sagar Suthram (Portland, Ore.), Debendra Mallik (Chandler, Ariz.), John Heck (Berkeley, Calif.), Pushkar Sharad Ranade (San Jose, Calif.), Ravindranath Vithal Mahajan (Chandler, Ariz.), Thomas Liljeberg (San Jose, Calif.), Wilfred Gomes (Portland, Ore.), Abhishek A. Sharma (Hillsboro, Ore.) and Tahir Ghani (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of a microelectronic assembly comprise: a plurality ...