US Patent Issued to Intel on Sept. 2 for "Power delivery through capacitor-dies in a multi-layered microelectronic assembly" (Arizona, Oregon, California Inventors)

ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,406,962, issued on Sept. 2, was assigned to Intel Corp. (Santa Clara, Calif.).

"Power delivery through capacitor-dies in a multi-layered microelectronic assembly" was invented by Adel A. Elsherbini (Tempe, Ariz.), William J. Lambert (Chandler, Ariz.), Krishna Bharath (Phoenix), Shawna M. Liff (Scottsdale, Ariz.), Nicolas Butzen (Portland, Ore.), Georgios Dogiamis (Chandler, Ariz.), Gerald S. Pasdast (San Jose, Calif.), Vivek Kumar Rajan (Portland, Ore.), Sathya Narasimman Tiagaraj (San Jose, Calif.) and Timothy Francis Schmidt (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure provide a microelectronic...