US Patent Issued to Intel on Oct. 27 for "Methods and apparatus utilizing conjugated polymers in integrated circuit packages with glass substrates" (Arizona Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,769, issued on Oct. 27, was assigned to Intel Corp. (Santa Clara, Calif.).

"Methods and apparatus utilizing conjugated polymers in integrated circuit packages with glass substrates" was invented by Shayan Kaviani (Phoenix), Benjamin Duong (Phoenix), Miranda Ngan (Chandler, Ariz.) and Mahdi Mohammadighaleni (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, apparatus, systems, and articles of manufacture utilizing conjugated polymers in integrated circuit packages with glass substrates are disclosed. A disclosed integrated circuit (IC) package includes: a glass substrate; a first electrode; an organic material; and a second electrode. T...