US Patent Issued to Intel on Oct. 14 for "On-cavity photonic integrated circuit (OCPIC) to achieve the most undercut real estate for effective thermal tuning" (Arizona, California Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,443,058, issued on Oct. 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"On-cavity photonic integrated circuit (OCPIC) to achieve the most undercut real estate for effective thermal tuning" was invented by Chia-Pin Chiu (Tempe, Ariz.), Kaveh Hosseini (Livermore, Calif.), Omkar Karhade (Chandler, Ariz.) and Tim Tri Hoang (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include an on-cavity photonic integrated circuit (OCPIC). In an embodiment, the OCPIC comprises a laser transmitter, that comprises a row with four bumps, and a micro-ring resonator (MRR) in the row between a first bump and a second bump ...