US Patent Issued to Intel on Nov. 3 for "Termination circuit coupled with a micro-ring modulator to reduce signal reflection" (California Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,763, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.).

"Termination circuit coupled with a micro-ring modulator to reduce signal reflection" was invented by Siamak Amiralizadeh Asl (San Jose, Calif.), David Hui (Santa Clara, Calif.) and Sanjeev Gupta (Santa Rosa, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure are directed to a photonic integrated circuit (PIC) that includes a micro-ring modulator (MRM) that is coupled with termination circuitry to reduce the reflection coefficient of the MRM when the PIC is electrically coupled to a driver. In embodiments, the termination circuitry may i...