US Patent Issued to Intel on Nov. 3 for "Packaging architecture with edge ring anchoring" (Oregon Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,814, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.).

"Packaging architecture with edge ring anchoring" was invented by Xavier Francois Brun (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic assembly is provided, comprising: an interposer having a first face and a second face opposite to the first face; a package substrate coupled to the first face; an integrated circuit die coupled to the second face; and an edge ring in the interposer. The interposer comprises a core comprising a first dielectric material and a redistribution layer (RDL), the RDL being on the first face or the second face, the RDL...