US Patent Issued to Intel on Nov. 3 for "Package substrate embedded multi-layered in via capacitors" (Arizona Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,784,991, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.).

"Package substrate embedded multi-layered in via capacitors" was invented by Suddhasattwa Nad (Chandler, Ariz.), Kristof Darmawikarta (Chandler, Ariz.), Benjamin Duong (Phoenix), Gang Duan (Chandler, Ariz.), Srinivas Pietambaram (Chandler, Ariz.), Brandon Marin (Gilbert, Ariz.), Jeremy Ecton (Gilbert, Ariz.), Jason Steill (Phoenix), Thomas Sounart (Chandler, Ariz.) and Darko Grujicic (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Apparatuses, capacitor structures, assemblies, and techniques related to package substrate embedded capacitors are described. A capac...