US Patent Issued to Intel on May 5 for "Package substrate including core with trench vias and planes" (Arizona Inventor)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,621,937, issued on May 5, was assigned to Intel Corp. (Santa Clara, Calif.).

"Package substrate including core with trench vias and planes" was invented by Telesphor Kamgaing (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein comprise package substrates and methods of forming package substrates. In an embodiment, a package substrate comprises a core substrate. A hole is disposed into the core substrate, and a via is disposed in the hole. In an embodiment, the via completely fills the hole. In an embodiment, a method of forming a package substrate comprises exposing a region of a core substrate with a laser. In an ...