US Patent Issued to Intel on May 19 for "Connector-less M.2 module" (Indian Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,633,688, issued on May 19, was assigned to Intel Corp. (Santa Clara, Calif.).

"Connector-less M.2 module" was invented by Shailendra Singh Chauhan (Bengaluru, India), Bijendra Singh (Bangalore, India), Siva Prasad Jangili Ganga (Jam Baugh, India), Santhosh Ap (Bangalore, India) and Ranjul Balakrishnan (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of connector-less modules and associated platforms employing the module. The module employs a Land Grid Array (LGA) comprising an array of LGA pins on the underside of the module PCB that are configured to engage respective pads patterned on a motherboard or system board PCB by app...