US Patent Issued to Intel on May 13 for "Filling openings by combining non-flowable and flowable processes" (Oregon Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,533, issued on May 13, was assigned to Intel Corp. (Santa Clara, Calif.).

"Filling openings by combining non-flowable and flowable processes" was invented by Ebony L. Mays (Hillsboro, Ore.) and Bruce J. Tufts (Banks, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are methods for manufacturing IC components using bottom-up fill of openings with a dielectric material. In one aspect, an exemplary method includes, first, depositing a solid dielectric liner on the inner surfaces of the openings using a non-flowable process, and subsequently filling the remaining empty volume of the openings with a fill dielectric using a flowable pr...