ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,695, issued on March 31, was assigned to Intel Corp. (Santa Clara, Calif.).
"Structure and process for warpage reduction" was invented by Hong Seung Yeon (Chandler, Ariz.), Liang He (Chandler, Ariz.), Whitney Bryks (Tempe, Ariz.), Jung Kyu Han (Chandler, Ariz.) and Gang Duan (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to a semiconductor carrier platform having a support panel with a top surface and a bottom surface, with the top surface providing a working surface for assembling IC packages using panel-level packaging technology. In an aspect, a backside molding layer may be positioned on the b...