US Patent Issued to Intel on March 31 for "Lane repair and lane reversal implementation for die-to-die (D2D) interconnects" (California Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,591,727, issued on March 31, was assigned to Intel Corp. (Santa Clara, Calif.).

"Lane repair and lane reversal implementation for die-to-die (D2D) interconnects" was invented by Lakshmipriya Seshan (Sunnyvale, Calif.), Gerald Pasdast (San Jose, Calif.), Peipei Wang (San Jose, Calif.), Narasimha Lanka (Dublin, Calif.), Swadesh Choudhary (Mountain View, Calif.), Zuoguo Wu (San Jose, Calif.) and Debendra Das Sharma (Saratoga, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one embodiment, an apparatus includes a first die comprising: a die-to-die adapter to communicate with protocol layer circuitry and physical layer circuitry, where the die-to-d...