US Patent Issued to Intel on March 3 for "Contact over active gate structures with trench contact layers for advanced integrated circuit structure fabrication" (Oregon Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,644, issued on March 3, was assigned to Intel Corp. (Santa Clara, Calif.).

"Contact over active gate structures with trench contact layers for advanced integrated circuit structure fabrication" was invented by Nazila Haratipour (Portland, Ore.), Gilbert Dewey (Beaverton, Ore.), I-Cheng Tung (Hillsboro, Ore.), Nancy Zelick (Portland, Ore.), Chi-Hing Choi (Portland, Ore.), Jitendra Kumar Jha (Hillsboro, Ore.) and Jack T. Kavalieros (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Contact over active gate (COAG) structures with trench contact layers, and methods of fabricating contact over active gate (COAG) structures using trench contac...