US Patent Issued to Intel on March 24 for "Substrates including micro-structured thin film capacitors" (Arizona Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,291, issued on March 24, was assigned to Intel Corp. (Santa Clara, Calif.).

"Substrates including micro-structured thin film capacitors" was invented by Chun-Hao Lin (Chandler, Ariz.), Teng Sun (Chandler, Ariz.) and Yuxin Fang (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are microelectronic assemblies including strengthened glass cores, as well as related devices and methods. In some embodiments, a microelectronic substrate with an in situ capacitor, the capacitor may include a first conductive layer having first microstructures at a first surface, a second conductive layer on the first conductive layer and havin...