US Patent Issued to Intel on March 24 for "Shielding assembly for semiconductor packages" (Malaysian Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,511, issued on March 24, was assigned to Intel Corp. (Santa Clara, Calif.).

"Shielding assembly for semiconductor packages" was invented by Poh Boon Khoo (Pulau Pinang, Malaysia), Jiun Hann Sir (Pulau Pinang, Malaysia), Min Suet Lim (Pulau Pinang, Malaysia), Seok Ling Lim (Kedah, Malaysia) and Yew San Lim (Pulau Pinang, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including a package substrate including a bottom surface; a first plurality of solder balls connected to the bottom surface of the package substrate; a second plurality of solder balls connected to a motherboard; and a shielding assembly interposed betwe...