US Patent Issued to Intel on March 24 for "Integrated circuit structures having airgaps for backside signal routing or power delivery" (Oregon, California Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,485, issued on March 24, was assigned to Intel Corp. (Santa Clara, Calif.).

"Integrated circuit structures having airgaps for backside signal routing or power delivery" was invented by Abhishek Anil Sharma (Portland, Ore.), Sagar Suthram (Portland, Ore.), Pushkar Ranade (San Jose, Calif.), Anand S. Murthy (Portland, Ore.), Tahir Ghani (Portland, Ore.), Rishabh Mehandru (Portland, Ore.) and Cory Weber (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Structures having airgaps for backside signal routing or power delivery are described. In an example, an integrated circuit structure includes a front-side structure including a device lay...