US Patent Issued to Intel on March 24 for "Fan enclosure with adjustable side venting" (Chinese, Chinese, American Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,585,315, issued on March 24, was assigned to Intel Corp. (Santa Clara, Calif.).

"Fan enclosure with adjustable side venting" was invented by Xiyong Tian (Beijing), Chunlin Bai (ChengDu, China), Baoci George Sun (Folsom, Calif.), Li Zhang (Shenzhen, China) and Chiu Lun Ronald Cheng (Kowloon, Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "Particular embodiments described herein provide for an electronic device that can be configured to include a first heat source, a second heat source, and a fan inside a fan enclosure between the first heat source and the second heat source. The fan enclosure includes a main vent to direct air from the fan towa...