US Patent Issued to Intel on March 17 for "Microelectronic assemblies with through die attach film connections" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,988, issued on March 17, was assigned to Intel Corp. (Santa Clara, Calif.).

"Microelectronic assemblies with through die attach film connections" was invented by Xiaoxuan Sun (Phoenix), Omkar G. Karhade (Chandler, Ariz.), Dingying Xu (Chandler, Ariz.), Sairam Agraharam (Chandler, Ariz.) and Xavier Francois Brun (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die, having a first surface with first conductive contacts and an opposing second surface with second conductive contacts, in a firs...