US Patent Issued to Intel on March 17 for "Device, method and system to sense voltages at sample points of respective interconnect structures" (American, Chinese, Mexican Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,578,363, issued on March 17, was assigned to Intel Corp. (Santa Clara, Calif.).

"Device, method and system to sense voltages at sample points of respective interconnect structures" was invented by Xiaoguo Liang (Shanghai), Farzaneh Yahyaei-Moayyed (Chandler, Ariz.), Nazar Haider (Fremont, Calif.), Nishi Ahuja (Portland, Ore.), Jie Yan (Shanghai) and Julio C. Cinco Galicia (Zapopan, Mexico).

According to the abstract* released by the U.S. Patent & Trademark Office: "Techniques and mechanisms for sensing a voltage difference across two interconnect structures of a multi-chip packaged device. In an embodiment, the interconnect structures provide respective voltages to each of multiple ...