US Patent Issued to Intel on June 9 for "Interconnect via metal-insulator-metal (MIM) fuse for integrated circuitry" (Arizona Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,027, issued on June 9, was assigned to Intel Corp. (Santa Clara, Calif.).

"Interconnect via metal-insulator-metal (MIM) fuse for integrated circuitry" was invented by Yao-Feng Chang (Flagstaff, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Interconnect via metal-insulator-metal (MIM) fuse for integrated circuitry. Two electrode metallization features, which may be within a backend of an IC die, are coupled through a via comprising a fuse material layer. The fuse material layer passes a non-zero leakage current when a lower read voltage is applied across the electrode metallization features, and irreversibly forms an open circuit when a higher ...