US Patent Issued to Intel on June 16 for "Package bottom side thermal solution with discrete hat-shaped copper spreader component" (Malaysian, Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,077, issued on June 16, was assigned to Intel Corp. (Santa Clara, Calif.).

"Package bottom side thermal solution with discrete hat-shaped copper spreader component" was invented by Min Suet Lim (Gelugor, Malaysia), Tin Poay Chuah (Bayan Baru, Malaysia), Yew San Lim (Gelugor, Malaysia), Jeff Ku (Taipei City, Taiwan), Twan Sing Loo (Butterworth, Malaysia), Poh Boon Khoo (Perai, Malaysia) and Jiun Hann Sir (Gelugor, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include a printed circuit board (PCB). In an embodiment, the PCB comprises a substrate with a first surface and a second surface opposite from the first su...