US Patent Issued to Intel on July 28 for "Multichip IC devices with die embedded in glass substrate and a redistribution layer interconnect bridge" (Arizona Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,804, issued on July 28, was assigned to Intel Corp. (Santa Clara, Calif.).

"Multichip IC devices with die embedded in glass substrate and a redistribution layer interconnect bridge" was invented by Jeremy Ecton (Gilbert, Ariz.), Brandon Marin (Gilbert, Ariz.), Srinivas Pietambaram (Chandler, Ariz.), Gang Duan (Chandler, Ariz.) and Suddhasattwa Nad (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Multi-die packages including a glass substrate within a space between adjacent IC dies. Two or more IC die may be placed within recesses formed in a glass substrate. The IC die and glass substrate, along with any conductive vias extending thro...