US Patent Issued to Intel on July 28 for "Microelectronic assemblies including solder and non-solder interconnects" (Taiwanese, German Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,800, issued on July 28, was assigned to Intel Corp. (Santa Clara, Calif.).

"Microelectronic assemblies including solder and non-solder interconnects" was invented by Alois Nitsch (Munich), Han-Wen Lin (Zhubei City, Taiwan), Yin-Ying Chen (Hsinchu City, Taiwan), Meng-Chi Lee (Taipei, Taiwan), Andreas Dost (Freising, Germany) and Hans Gerard Jetten (Anzing, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die, having a first surface and an opposing second surface; a redistribution layer (RDL) having a...