US Patent Issued to Intel on July 28 for "Architectures for backside power delivery with stacked integrated circuit devices" (Arizona Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,807, issued on July 28, was assigned to Intel Corp. (Santa Clara, Calif.).

"Architectures for backside power delivery with stacked integrated circuit devices" was invented by Suddhasattwa Nad (Chandler, Ariz.), Srinivas Pietambaram (Chandler, Ariz.), Brandon Marin (Gilbert, Ariz.), Jeremy Ecton (Gilbert, Ariz.) and Gang Duan (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus is provided which comprises: an integrated circuit logic device, an integrated circuit power device conductively coupled with a first surface of the integrated circuit logic device, wherein the integrated circuit power device extends laterally beyond a ...