US Patent Issued to Intel on July 21 for "Photonics integrated circuit device packaging" (British, American Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,687,684, issued on July 21, was assigned to Intel Corp. (Santa Clara, Calif.).

"Photonics integrated circuit device packaging" was invented by Pooya Tadayon (Portland, Ore.), Eric J. M. Moret (Beaverton, Ore.), Tarek A. Ibrahim (Mesa, Ariz.), David Shia (Portland, Ore.), Nicholas D. Psaila (Lanark, Great Britain) and Russell Childs (Edinburgh, Great Britain).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one embodiment, an integrated circuit device includes a substrate, an electronic integrated circuit (EIC), a photonics integrated circuit (PIC) electrically coupled to the EIC, and a glass block at least partially in a cavity defined by the substrate ...