US Patent Issued to Intel on July 21 for "Embedded passives with cavity sidewall interconnect in glass core architecture" (Arizona Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,136, issued on July 21, was assigned to Intel Corp. (Santa Clara, Calif.).

"Embedded passives with cavity sidewall interconnect in glass core architecture" was invented by Kristof Darmawikarta (Chandler, Ariz.), Srinivas Venkata Ramanuja Pietambaram (Chandler, Ariz.), Tarek A. Ibrahim (Mesa, Ariz.), Cary Kuliasha (Mesa, Ariz.), Siddharth K. Alur (Chandler, Ariz.), Jung Kyu Han (Chandler, Ariz.), Beomseok Choi (Chandler, Ariz.), Russell K. Mortensen (Chandler, Ariz.), Andrew Collins (Chandler, Ariz.), Haobo Chen (Chandler, Ariz.) and Brandon C. Marin (Gilbert, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a substr...