US Patent Issued to Intel on July 14 for "Thermal structure for a micro-ring resonator (MRR) in a photonic integrated circuit (PIC)" (Arizona, California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,243, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Thermal structure for a micro-ring resonator (MRR) in a photonic integrated circuit (PIC)" was invented by Chia-Pin Chiu (Tempe, Ariz.), Omkar G. Karhade (Chandler, Ariz.) and Kaveh Hosseini (Livermore, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Variations in a thermal structure for an open cavity photonic integrated circuit (OCPIC) having an MRR. The structure includes an air trench in fluid communication with an air cavity that is located under the MRR. The air trench is a gap/opening in the oxide that encircles at least a portion of the MRR and extends outward ...