US Patent Issued to Intel on July 14 for "Semiconductor package with extended stiffener" (Malaysian Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,171, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Semiconductor package with extended stiffener" was invented by Bok Eng Cheah (Gelugor, Malaysia), Seok Ling Lim (Kulim, Malaysia), Jenny Shio Yin Ong (Bayan Lepas, Malaysia), Jackson Chung Peng Kong (Tanjung Tokong, Malaysia) and Kooi Chi Ooi (Gelugor, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including: a package substrate including a base die disposed on a top surface of the package substrate, the base die including a plurality of electrical components disposed on a top surface of the base die, the plurality of electrical components in...