US Patent Issued to Intel on July 14 for "Multichip IC devices in glass medium and including an interconnect bridge die" (Arizona Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,194, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Multichip IC devices in glass medium and including an interconnect bridge die" was invented by Jeremy Ecton (Gilbert, Ariz.), Brandon Marin (Gilbert, Ariz.), Srinivas Pietambaram (Chandler, Ariz.), Hiroki Tanaka (Gilbert, Ariz.) and Suddhasattwa Nad (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Multi-die packages including at least one glass substrate within a space between two adjacent IC dies or surrounding an interconnect bridge die. The various IC dies may be placed within recesses formed in the glass substrate. The IC die and glass substrate, along wit...