US Patent Issued to Intel on July 14 for "Generic modular sparse three-dimensional (3D) convolution design utilizing sparse 3D group convolution" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,682,604, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Generic modular sparse three-dimensional (3D) convolution design utilizing sparse 3D group convolution" was invented by Anbang Yao (Beijing), Jiahui Zhang (Beijing), Dawei Sun (Beijing), Dian Gu (Shanghai) and Yurong Chen (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments are generally directed to sparse 3D convolution acceleration in a convolutional layer of an artificial neural network model. An embodiment of an apparatus includes one or more processors including a graphics processor to process data; and a memory for storage of data, including feature maps...