US Patent Issued to Intel on July 14 for "Direct bonding in microelectronic assemblies" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,189, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Direct bonding in microelectronic assemblies" was invented by Aleksandar Aleksov (Chandler, Ariz.), Adel A. Elsherbini (Chandler, Ariz.), Shawna M. Liff (Scottsdale, Ariz.), Johanna M. Swan (Scottsdale, Ariz.), Feras Eid (Chandler, Ariz.), Randy B. Osborne (Beaverton, Ore.) and Van H. Le (Beaverton, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are microelectronic assemblies including microelectronic components that are coupled together by direct bonding, as well as related structures and techniques. For example, in some embodiments, a microelectronic ...