US Patent Issued to Intel on Jan. 27 for "Power delivery for embedded bridge die utilizing trench structures" (Arizona Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,823, issued on Jan. 27, was assigned to Intel Corp. (Santa Clara, Calif.).

"Power delivery for embedded bridge die utilizing trench structures" was invented by Kemal Aygun (Tempe, Ariz.), Zhiguo Qian (Chandler, Ariz.) and Jianyong Xie (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods/structures of joining package structures are described. Those methods/structures may include a die disposed on a surface of a substrate, an interconnect bridge embedded in the substrate, and at least one vertical interconnect structure disposed through a portion of the interconnect bridge, wherein the at least one vertical interconnect structure is...