US Patent Issued to Intel on Jan. 27 for "Fin patterning for advanced integrated circuit structure fabrication" (Oregon Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,545, issued on Jan. 27, was assigned to Intel Corp. (Santa Clara, Calif.).

"Fin patterning for advanced integrated circuit structure fabrication" was invented by Curtis Ward (Hillsboro, Ore.), Heidi M. Meyer (Hillsboro, Ore.), Michael L. Hattendorf (Portland, Ore.) and Christopher P. Auth (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a first plurality of semico...