US Patent Issued to Intel on Jan. 20 for "Metallic sealants in transistor arrangements" (Oregon Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,526, issued on Jan. 20, was assigned to Intel Corp. (Santa Clara, Calif.).

"Metallic sealants in transistor arrangements" was invented by Abhishek A. Sharma (Hillsboro, Ore.), Tahir Ghani (Portland, Ore.), Jack T. Kavalieros (Portland, Ore.), Gilbert W. Dewey (Beaverton, Ore.), Van H. Le (Beaverton, Ore.), Lawrence D. Wong (Beaverton, Ore.) and Christopher J. Jezewski (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are transistor electrode-channel arrangements, and related methods and devices. For example, in some embodiments, a transistor electrode-channel arrangement may include a channel material, source/drain elec...