US Patent Issued to Intel on Jan. 20 for "Metal organic frameworks (MOFS) filler for enabling low CTE and low dielectric constant PCB" (Arizona, Oregon Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,412, issued on Jan. 20, was assigned to Intel Corp. (Santa Clara, Calif.).

"Metal organic frameworks (MOFS) filler for enabling low CTE and low dielectric constant PCB" was invented by Yang Jiao (Chandler, Ariz.), Kyle Davidson (Hillsboro, Ore.), Srinivasa Aravamudhan (Portland, Ore.) and Jerry T. Harris (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a printed circuit board (PCB), where the PCB comprises a glass weave, a resin, and metal organic frameworks (MOFs) disposed within the resin. In an embodiment, a package substra...