US Patent Issued to Intel on Feb. 3 for "Tunable stack-up DIMM form factor cold plate with embedded peltier devices for enhanced cooling capability" (California Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,567, issued on Feb. 3, was assigned to Intel Corp. (Santa Clara, Calif.).

"Tunable stack-up DIMM form factor cold plate with embedded peltier devices for enhanced cooling capability" was invented by Prabhakar Subrahmanyam (San Jose, Calif.), Yi Xia (Campbell, Calif.), Ying-Feng Pang (San Jose, Calif.) and Ridvan A. Sahan (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus is described. The apparatus includes a metallic chamber having a first outer surface with first Peltier devices and a second outer surface with second Peltier devices. The first and second outer surfaces face in opposite directions such that the first Pelt...