US Patent Issued to Intel on Feb. 3 for "Heat exchange apparatus and methods for hyperbaric cooling fan applications" (Taiwanese, Indian Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,290, issued on Feb. 3, was assigned to Intel Corp. (Santa Clara, Calif.).

"Heat exchange apparatus and methods for hyperbaric cooling fan applications" was invented by Jeff Ku (Taipei, Taiwan), Chi Chou Cheng (Taoyuan, Taiwan), Jeffrey Ho (New Taipei, Taiwan), Chih-Tsung Hu (New Taipei, Taiwan), Srinivasarao Konakalla (Bangalore, India), Tsung-Kai Lin (New Taipei, Taiwan), Arnab Sen (Whitefield, India), Chiu-Chun Wang (Taoyuan, Taiwan) and Jiacheng Wu (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Heat exchange apparatuses and methods for hyperbaric cooling fan applications such as computing devices. The apparatus comprises a material...