US Patent Issued to Intel on Feb. 24 for "Packaging architecture with reinforcement structure in package substrate" (German, American Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,058, issued on Feb. 24, was assigned to Intel Corp. (Santa Clara, Calif.).

"Packaging architecture with reinforcement structure in package substrate" was invented by Mohan Prashanth Javare Gowda (Ottobrunn, Germany), Stephan Stoeckl (Schwandorf, Germany), Thomas Wagner (Regelsbach, Germany), Sonja Koller (Bavaria, Germany), Wolfgang Molzer (Ottobrunn, Germany) and Pouya Talebbeydokhti (Gilbert, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of a microelectronic assembly comprise a package substrate, including: a first layer comprising a first plurality of mutually parallel channels of a first material; a second layer comprising col...