US Patent Issued to Intel on Feb. 24 for "Edge-aligned template structure for integrated packages including an integrated circuit device within an opening of the template structure" (Arizona Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,090, issued on Feb. 24, was assigned to Intel Corp. (Santa Clara, Calif.).

"Edge-aligned template structure for integrated packages including an integrated circuit device within an opening of the template structure" was invented by Debendra Mallik (Chandler, Ariz.), Omkar Karhade (Chandler, Ariz.), Sairam Agraharam (Chandler, Ariz.) and Nitin Deshpande (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit assemblies can be fabricated on a wafer scale, wherein a base template, having a plurality of openings, may cover a base substrate, such as a die wafer, wherein the base substrate has a plurality of first integrated cir...