US Patent Issued to Intel on Feb. 17 for "Type-3 printed circuit boards (PCBS) with hybrid layer counts" (Indian, Malaysian Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,216, issued on Feb. 17, was assigned to Intel Corp. (Santa Clara, Calif.).

"Type-3 printed circuit boards (PCBS) with hybrid layer counts" was invented by Arumanayagam Rajasekar (Bangaluru, India), Tin Poay Chuah (Bayan Baru, Malaysia), Sushil Padmanabhan (Thrissur, India), Aiswarya M. Pious (Bangalore, India) and Navneet Kumar Singh (Bangalore, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one embodiment, a printed circuit board includes a first circuit board portion comprising a set of first conducting layers and one or more plated through hole (PTH) vias formed through the first conducting layers and a second circuit board portion compr...