US Patent Issued to Intel on Feb. 17 for "Solder grid array for attachment of a die package" (Arizona Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,683, issued on Feb. 17, was assigned to Intel Corp. (Santa Clara, Calif.).

"Solder grid array for attachment of a die package" was invented by Mukund Ayalasomayajula (Chandler, Ariz.), Dinesh Padmanabhan Ramalekshmi Thanu (Chandler, Ariz.), Rui Zhang (Chandler, Ariz.), Xiao Lu (Chandler, Ariz.), Robert Nickerson (Chandler, Ariz.) and Patrick Neel Stover (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A die package comprises a substrate comprising a solder pad element, a semiconductor die coupled to the substrate, a solder layer comprising a first solder material deposited on the solder pad element, the first solder material having a ...