US Patent Issued to Intel on Feb. 17 for "Inorganic redistribution layer on organic substrate in integrated circuit packages" (Oregon, Arizona Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,675, issued on Feb. 17, was assigned to Intel Corp. (Santa Clara, Calif.).

"Inorganic redistribution layer on organic substrate in integrated circuit packages" was invented by Xavier Francois Brun (Hillsboro, Ore.), Sanka Ganesan (Chandler, Ariz.), Holly Sawyer (Aloha, Ore.) and Timothy A. Gosselin (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) package, comprising a die having a first set of interconnects of a first pitch, and an interposer comprising an organic substrate having a second set of interconnects of a second pitch. The interposer also includes an inorganic layer over the organic substrate. The inorgani...