US Patent Issued to Intel on Feb. 17 for "Embedded semiconductive chips in reconstituted wafers, and systems containing same" (Arizona Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,665, issued on Feb. 17, was assigned to Intel Corp. (Santa Clara, Calif.).

"Embedded semiconductive chips in reconstituted wafers, and systems containing same" was invented by Robert L. Sankman (Phoenix) and John S. Guzek (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A reconstituted wafer includes a rigid mass with a flat surface and a base surface disposed parallel planar to the flat surface. A plurality of dice are embedded in the rigid mass. The plurality dice include terminals that are exposed through coplanar with the flat surface. A process of forming the reconstituted wafer includes removing some of the rigid mass to expose ...