US Patent Issued to Intel on Feb. 17 for "Device and method for real-time offset adjustment of a semiconductor die placement" (Arizona Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,594, issued on Feb. 17, was assigned to Intel Corp. (Santa Clara, Calif.).

"Device and method for real-time offset adjustment of a semiconductor die placement" was invented by Hong Seung Yeon (Chandler, Ariz.), Mariano Phielipp (Mesa, Ariz.), Yi Li (Chandler, Ariz.), Minglu Liu (Chandler, Ariz.), Robin McRee (Chandler, Ariz.), Yosuke Kanaoka (Chandler, Ariz.) and Gang Duan (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for real-time offset adjustment of a semiconductor die placement comprising: obtaining or receiving operational parameters of a die mounting tool in real-time, wherein the die mounting tool is configured for ...