US Patent Issued to Intel on Feb. 10 for "Techniques for mapping memory allocation to DRAM dies of a stacked memory module" (Indian, American Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,547,329, issued on Feb. 10, was assigned to Intel Corp. (Santa Clara, Calif.).

"Techniques for mapping memory allocation to DRAM dies of a stacked memory module" was invented by Ramkumar Jayaraman (Bangalore, India), Krishnaprasad H (Bangalore, India) and Robert A. Branch (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatus for mapping memory allocation to DRAM dies of a stacked memory modules are described herein. Memory address ranges in a module employing 3DS (three dimensional stacked) DRAMs (Dynamic Random Access Memories) comprising stacked DRAM dies are mapped to DRAM dies in the module based on a layer of the DRAM...